Energy efficient solutions for wafer cleaning (Oct 2012 – Aug 2013)

Silicon wafers are key products for semiconductor industry. For high precision manufacturing processes, these wafers should be free from any dust and particles. However, curret wafer cleaning processes are not water and energy efficient. In this project, we investigated water and energy efficient solutions for wafer cleaning. We were particulary interested in cleaning wafers using couple of water droplets. We studied several methods to move the water droplets on the wafers such as electroadhesive and capillary forces.

Keywords: Energy efficient, wafer, adhesion, cleaning, capillary forces

People: Yasemin Vardar (TNO), several engineers from TNO

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google+ photo

You are commenting using your Google+ account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s