Silicon wafers are key products for semiconductor industry. For high precision manufacturing processes, these wafers should be free from any dust and particles. However, curret wafer cleaning processes are not water and energy efficient. In this project, we investigated water and energy efficient solutions for wafer cleaning. We were particulary interested in cleaning wafers using couple of water droplets. We studied several methods to move the water droplets on the wafers such as electroadhesive and capillary forces.
Keywords: Energy efficient, wafer, adhesion, cleaning, capillary forces
People: Yasemin Vardar (TNO), several engineers from TNO